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ISP:Gandi SAS TLD:org Code postal:fr
Ce rapport est mis à jour en 09-Aug-2018
Created Date:
2001-11-22
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33 1 45 05 72 32 facebook home news -france infos advancing microelectronics jobs events event calendar past events power 2018 thermal 2019 links other chapters about france about us contacts members area archives gallery call you are here: home who we are... welcome to the france - international microelectronics assembly and packaging society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies. the society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information. this is achieved through networking, seminars, workshops, short courses, publications, webinars and websites. members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. is the largest microelectronic packaging society in the world ! -france (french chapter) is a non-profit organization with 200 members in 2017 from 110 companies or institutes in france and neighbouring countries (belgium, switzerland, morocco, spain, portugal). -france is one out of the 30 chapters throughout the world. to that end, we organize events each year. in 2018-2019, in french or english language, these are namely: power 2018 thermal 2019 minapad 2019 we will be glad to see you join us for one of these events. upcoming events: power 2018 power 2018 following the success of the power electronics workshop organized over the past 9 years in partnership with greman (umr 7347) and polytech-tours, sponsored by st-microelectronics and éolane, -france proudly announces the 10 th edition of the power electronics and packaging, technical & international workshop to be held in tours, france on 8 th november 2018 the city of tours is located along the scenic loire valley which is famous for its castles built along the river. for the fifth time, the event’s scope becomes international and the workshop will be held in english thermal 2019 thermal 2019 the workshop will present latest improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, rf, microwave and other devices and sub-systems. increases in functionality, complexity, miniaturisation, operating temperature and power output require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems. industry transition to sic and gan devices allows higher operating temperatures with higher heat flux but also a greater reliability. these trends also require improvements and changes in packaging and thermal materials. thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels minapad 2019 minapad 2019 adhésion à france adhésion en ligne bulletin d'adhésion france à remplir et à envoyer france info contact us address: france 17, rue de l'amiral hamelin paris 75016 france phone: 33 1 45 05 72 32 e-mail: .france at france.org copyright 2016 france. all rights reserved. about contacts blog forum careers
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